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apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 1 specification ssc-SZR05A0A rohs
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 3 features applications description SZR05A0A * the appearance and specifications of the product can be changed for improvement without notice. ? general torch ? architectural lighting ? projector light source ? traffic signals ? task lighting ? decorative / pathway lighting ? remote / solar powered lighting ? automotive interior / exterior lighting ? automotive signal / forward lighting SZR05A0A the z-power series is designed for high current operation and high flux output applications. it incorporates state of the art smd design and low thermal resistant material. the z power led is ideal light sources for general illumination applications, custom designed solutions, large back lights and high performance torches. ? super high flux output and high luminance ? designed for high current operation ? smt solderable ? lead free product ? rohs compliant
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 3 [ contents ] 1. full code of z5 series 2. outline dimensions 3. characteristics of SZR05A0A (red) 4. characteristic diagrams 5. bin code description 6. labeling 7. packing 8. recommended solder pad 9. soldering 10. precaution for use 11. handling of silicone resin leds
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 4 1. full code of z5 series revision no. x 8 2. internal number red r0 full code form : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 1. part number z5 series 5 pkg series x 5 color specification x 3 x 4 z-power led series number x 2 pcb type x 7 lens type x 6 x 1 company 4
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 5 notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.1mm 2. outline dimensions
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 6 3. characteristics of SZR05A0A (red) v 5 v r reverse voltage (ta=25 , rh30%) unit value symbol parameter ma 700 i f forward current w 2.3 p d power dissipation oc 125(@ i f 700ma) t j junction temperature oc -40 ~ +100 t opr operating temperature oc -40 ~ +100 t stg storage temperature kv 2 - esd sensitivity(hbm) [6] deg. 123 2 ? view angle k /w 7.0 r j-s thermal resistance (j to s) v 3.0 2.4 - v f forward voltage [4] 1-2 absolute maximum ratings 1-1 electro-optical characteristics at 350ma red parameter symbol value unit min typ max luminous flux [1] v [2] 41.5 55 60 lm v (tj=100 ) - 26 - dominant wavelength [3] d 618 625 632 nm 6 *notes : [1] ssc maintains a tolerance of 7% on flux and power measurements. [2] v is the total luminous flux output as measured with an integrating sphere. [3] correlated color temperature is derived from th e cie 1931 chromaticity diagram. color coordinate : 0.005, cct 5% tolerance. [4] tolerance is 0.06v on forward voltage measurements [5] a zener diode is included to protect the product from esd. [6] tolerance is 2.0 on cri measurements
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 7 color spectrum (if=350ma, ta=25 , rh30%) 4. characteristic diagrams 7 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 relative spectral power distribution wavelength [nm]
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 8 forward current vs. normalized relative luminous flux , ta=25 forward voltage vs. forward current, ta=25 forward current characteristics 0.0 0.2 0.4 0.6 0.8 0.0 0.5 1.0 1.5 2.0 relative luminous flux [x100,%] forward current [a] SZR05A0A 1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 SZR05A0A forward current[a] forward voltage[v]
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 9 forward current vs wavelength shift, ta=25 0.0 0.2 0.4 0.6 0.8 -4 -3 -2 -1 0 1 2 3 4 dominant wavelength shift [nm] forward current [ma] SZR05A0A
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 10 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous flux [x100,%] junction temperature[ o c] SZR05A0A junction temperature characteristics junction temperature vs. forward voltage at if=350ma junction temperature vs. relative light output at if= 350ma 40 60 80 100 120 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 SZR05A0A forward voltage shift [v] junction temperature[ o c]
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 11 junction temperature characteristics 11 junction temperature vs. dominant wavelength at if=3 50ma 40 60 80 100 120 0 2 4 6 8 10 SZR05A0A dominant wavelength shift [nm] junction temperature [ o c]
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 12 -80 -60 -40 -20 0 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous flux angle [deg] 0 30 60 90 characteristic diagrams ambient temperature vs. allowable forward current (tj max = 125 , @0.7a) radiation pattern at 350ma 0 20 40 60 80 100 120 0 100 200 300 400 500 600 700 800 r j-a=20 /w forward current [ma] ambient temperature [c] r j-a=15 /w 125
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 13 5. bin code description radiant power (mw ) @ i f = 350ma bin code min. max. r 41.5 54.0 s 54.0 70.0 bin code radiant power (mw ) @ i f = 350ma dominant wavelength (nm) @ i f = 350ma forward voltage (v) @ i f = 350ma r rr1 e 2.50 2.25 e forward voltage (v) @ i f = 350ma bin code min. max. d 2.00 2.25 f 2.50 2.75 632 625 rr2 625 618 rr1 dominant wavelength (nm) @ i f = 350ma bin code min. max. 13
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 14 6. labeling - x 10 : luminous flux : lf [lm] -x 11 x 12 : dominant wavelength [nm] -x 13 : forward voltage : v f [v] rank x 10 x 11 x 12 x 13 lot no # 1 # 2 # 3 # 4 # 5 # 6 - # 7 # 8 # 9 # 10 - # 11 # 12 # 13 - # 1 # 2 : year - # 3 # 4 : month - # 5 # 6 : day - # 7 # 8 # 9 # 10 : mass order - # 11 # 12 # 13 : tray no. 1000 ############### SZR05A0A SZR05A0A x 10 x 11 x 12 x 13 14 x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 - x 1 : company - x 2 : z-power led series number - x 3 x 4 : color specification - x 5 : pkg series - x 6 : lens type - x 7 : pcb type -x 8 : revision no. full code form
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 15 cathode mark cathode mark cathode mark cathode mark 13 22 7. packing
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 16 7. packing 16 1 side outer box structure material : paper(sw3b(b)) a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type 7inch size (mm) 220 245 245 220 a b 102 142 c
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 17 8. recommended solder pad notes : [1] all dimensions are in millimeters. [2] scale : none [3] this drawing without tolerances are for referen ce only [4] undefined tolerance is 0.1mm 17
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 18 ipc/jedec j-std-020 profile feature sn-pb eutectic assembly pb-free assemb ly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature max (tsmax) - time (tsmin to tsmax) (ts) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: - temperature (tl) - time (tl) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature (tp) 215 260 time within 5 c of actual peak temperature (tp)2 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. * caution 1. reflow soldering is recommended not to be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. 2. repairs should not be done after the leds have be en soldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds dur ing heating. 5. after soldering, do not warp the circuit board. 9. soldering 18
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 19 (1) storage to avoid the moisture penetration, we recommend sto ring z5 series (z power) leds in a dry box with a desiccant . the recommended sto rage temperature range is 5 to 30 and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smd techniques when the led is to be sol dered dipped as separation of the lens may affect the light output efficiency. pay attenti on to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 1 year (msl 2) or the color of the desiccant changes, components should be dried f or 10-12hr at 60 5 (3) do not apply mechanical force or excess vibrati on during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components should not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products listed here in. (7) gallium arsenide is used in some of the product s listed in this publication. these products are dangerous if they are burned or shredded in the pro cess of disposal. it is also dangerous to drink the liquid or inhale the gas generated by suc h products when chemically disposed of. (8) this device should not be used in any type of f luid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) s hould be used. (9) when the leds are in operation the maximum curren t should be decided after measuring the package temperature. (10) leds must be stored properly to maintain the de vice. if the leds are stored for 3 months or more after being shipped from ssc, a sealed contain er with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the produ ct may be modified for improvement without notice. (12) long time exposure of sunlight or occasional u v exposure will cause lens discoloration. 10. precaution for use 19
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 20 (13) vocs (volatile organic compounds) emitted from m aterials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a significant lo ss of light output from the fixture. knowledge of the properties of the materials select ed to be used in the construction of fixtures can help prevent these issues. (14) the slug is isolated from anode electrically. therefore, we recommend that you dont isolate the heat sink. (15) attaching leds, do not use adhesives that outg as organic vapor. (16) the driving circuit must be designed to allow forward voltage only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage. 10. precaution for use 20
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 12 (rev.00) 21 (1) during processing, mechanical stress on the sur face should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surfac e can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, ex cept that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the hand ling of such devices. compared to standard encapsulants, silicone is gene rally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level o f dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleani ng. in case other solvents are used, it must be assured that these solvents do not disso lve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another re sin (epoxy, urethane, etc) and do not handle this product with acid or sulfur mate rial in sealed space. (7) avoid leaving fingerprints on silicone resin pa rts. 11. handling of silicone resin leds 21

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